1 / 3 www.asb.co.kr july 2011 p lerow tm ALN0667 internally matched lna module parameter unit specifications min typ max frequency range mhz 470 860 gain db 34 35 gain flatness db 1.6 1.8 noise figure (nf) db 0.80 0.85 output ip3 (1) dbm 39 40 s11 / s22 (2) db - 15 / - 13 output p1db dbm 20 21 switching time (3) m sec supply current ma 140 160 supply voltage v 5 impedance w 75 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 40 c to +85 c. 1) oip3 is measured wit h two tones at an output power of 5 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage f rom 0 v to vs. pin number function 3 rf in 8 rf out 10 v s other s ground s 21 = 36.6 db @ 470 mhz = 33.4 db @ 860 mhz nf of 0.8 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current the plerow tm aln - series is the compactly designed surface - mount module for the use of the ln a with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. ou t line drawing (unit: mm) feature s specifications (in pr o duction) note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the lef t side. description ALN0667 asb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) typ. @ t = 25 c, v s = 5 v, freq. = 665 mh z, z o.sys = 75 ohm website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type
2 / 3 www.asb.co.kr july 2011 p lerow tm ALN0667 internally matched lna module s - param e ters noise figure oip3 p1db 470~860 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 3 www.asb.co.kr july 2011 p lerow tm ALN0667 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical perform ance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 c apacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit r ecommended soldering reflow process + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor 20~40 sec 260 c 200 c 150 c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 c/sec) in out vs size 25x25mm (for aln series C 13x13mm) evaluation board layout
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